APIBIPP

Loading

  • Sep, Thu, 2020

CAS 2386-87-0 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate From Manuacturer

Quick Details Port: Shanghai Qingdao Tianjin Dalian Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram,Paypal Supply Ability: 1000 Ton/Tons per Year Other Names: 3,4-epoxycyclohexanecarboxylicacid(3,4-epoxycyclohexylmethyl)ester Sample: Available Purity: 97.0%min MSDS&COA: Available Grade: Pharmaceutical grade Appearance: Colorless transparent liquid, no visible mechanical impurities,Colorless transparent liquid, no visible mechanical impurities CAS No.: 2386-87-0 Item: 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate Payment: T/T, L/C at sight, Western Union, Paypal Type: pharmaceutical intermediates,Medicine intermediate Packing: 25kg/drum, 200kg/drum or as customer request Customers: USA, Korea, Japan,etc EINECS No.: 219-207-4 MF: C14H20O4 Application: Used as intermediates,UV-Ink and UV-Coating, LED encapsulation, Delivery Detail: Shipment within 5-7 working days after receive your payment. Packaging Detail: 25kg/drum, 200kg/drum or as customer request. 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate From Manuacturer       1. Specification of CAS 2386-87-0 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate Item Specifications Results Test Method Appearance Colorless transparent liquid, no visible mechanical impurities Colorless transparent liquid, no visible mechanical impurities Visual Viscosity (CP) 220~450 247 GB-T265-1988 Epoxy Equivalent 126~135 126.9 GB/T4612-2008 Colour (Hazen) ≤50 15 GB/T605-2006 Moisture ≤0.05% 0.02% Kari Fishcher Purity ≥97% 98.1% GC Density, g/ml 1.150~1.180 1.166 25℃ Total chlorine ≤100ppm 46ppm ICS Conclusion The results conforms with Enterprise standards     2. Packing of CAS 2386-87-0 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate 25kg/drum, 200kg/drum or as customer request.     3. Application of CAS 2386-87-0 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate Used in UV-Ink and UV-Coating, LED encapsulation, electrical potting materials, molding compound for semiconductor, optical adhesives as well […]